| abstract |
The present invention provides an apparatus and method for a 3-D device package having a backside interconnect. One or more of the device components can be hermetically sealed from a surrounding environment, such as by vacuum lamination and bonding. One or more via connectors provide electrical interconnection from a device component to a back side of a device substrate and provide electrical interconnection from the device substrate to an external circuit on the back side of the device. The external circuit can include a printed circuit board or a flex circuit. In some embodiments, a conductive pad electrically connected to at least one of the via connectors is provided on the back side. In some embodiments, the one or more via connectors are electrically connected to one or more electrical components or interconnects, such as a TFT or a wiring. |