| abstract |
The invention relates to a multilayer carrier foil, a core structure formed by the multilayer carrier foil, a printed circuit board and an electronic device. The multi-layer carrier foil includes: (a) a copper carrier layer having a peeling side and a laminating side, the laminated side of the copper carrier layer optionally has roughened particles; (b) a chromium peeling layer applied to the Copper carrier layer (a); (c) intermediate copper layer applied to the chromium stripping layer (b); (d) anti-migration layer applied to the intermediate copper layer (c); and (e) ultra-thin copper The layer is applied to the anti-migration layer (d). The invention relates to the multi-layer carrier foil, the core structure and the preparation method of the printed circuit board. |