| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0758
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0048
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-2041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0397 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| filingDate |
2017-09-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e2cf846501de5191624a40418c03b36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24fc1b958be16a1abc66d8bdf424bf85 |
| publicationDate |
2018-09-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201831998-A |
| titleOfInvention |
Photosensitive ray- or radiation-sensitive resin composition, resist film, pattern forming method, and method of manufacturing electronic component |
| abstract |
The present invention provides a photoresistive or radiation-sensitive resin composition capable of forming a resist film having excellent water repellency and improved hydrophilicity after being contacted with an alkali developing solution, and capable of forming a pattern having excellent LWR. Etching film, pattern forming method, and manufacturing method of electronic component. Photosensitized or radiation-sensitive resin compositions include: resin A, which increases the solubility of an alkali developer by the action of an acid; compound B, which generates an acid by irradiation with actinic rays or radiation; resin C, The surface energy exceeds 25 mJ / m 2 , has at least one of a fluorine atom and a silicon atom, and has a polarity conversion group; and the resin D has a surface energy of 25 mJ / m 2 or less. The content of the resin D is 1.1% by mass or more based on the total solid content of the actinic radiation- or radiation-sensitive resin composition. |
| priorityDate |
2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |