| abstract |
It roughly presents an integrated circuit package substrate having a high-density interconnect architecture for scaling high-density wiring, and related structures, devices, and methods. More specifically, there is presented an integrated circuit package substrate having fan-out wiring based on a high-density interconnect layer, which may include pillars and vias, and an integrated cavity for die attach. In addition, an integrated circuit package substrate with self-aligned pillars and vias formed on a high-density interconnect layer and related methods are presented. |