http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201829176-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J123-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J123-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
| filingDate | 2017-07-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fc46feb44b9557b67015f6fb6b3565b3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2491414acab054e511a3e7bce4e222c7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dccf77564b8f3958162436a14b34237d http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a8c0c39bc943c5917f779d0574709cbc |
| publicationDate | 2018-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201829176-A |
| titleOfInvention | Laminate with low dielectric adhesive layer |
| abstract | [Problem] The present invention provides a laminate which not only has high adhesion to conventional polyimide and polyester films, but also has high adhesion to low-polarity resin substrates or metal substrates such as LCP, and can High solder heat resistance is obtained, and low dielectric properties are excellent. [Solution] A laminated body (Z) is obtained by laminating a resin base material and a metal base material with an adhesive laminate layer containing a carboxyl group-containing polyolefin resin (A), and is characterized by: (1) Laminating The relative dielectric constant (ε c ) of the laminated body (X) obtained by removing the metal substrate from the body (Z) at a frequency of 1 MHz is 3.0 or less; (2) Obtained by removing the metallic substrate from the laminated body (Z) The dielectric tangent (tanδ) of the laminated body (X) at a frequency of 1 MHz is 0.02 or less; (3) The peel strength of the resin substrate and the metal substrate is 0.5 N / mm or more; (4) the laminated body (Z The heat resistance of the humidified solder is 240 ° C or higher. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724563-B |
| priorityDate | 2016-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 98.