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publicationDate 2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201828457-A
titleOfInvention Inverted step contact for improved density of 3D stacked devices
abstract A semiconductor stacking device comprising a first plurality of device layers separated from each other by a first plurality of dielectric layers, a first conductive via coupled to a contact portion of the device layer of the first plurality of device layers, by a second a second plurality of device layers separated from each other by a plurality of dielectric layers, and a second conductive via coupled to a contact portion of the device layer of the second plurality of device layers. a first conductive via extending to a front surface of the semiconductor stacked device and a second conductive via extending to a back surface of the semiconductor stacked device, the first plurality of device layers forming a step pattern in the first direction, and the second plurality The device layer forms a step pattern in a second direction that is inverted from the first direction.
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