| abstract |
The purpose is to provide a material that requires photo-patterning without compromising the heat resistance that can withstand the heat generated during the manufacture of substrates such as soldering and components, maintain high insulation for a long time, and resistance to chemical treatments such as plating. The basic characteristics of this type of solder resist, etc., combine the flexibility and toughness of flexible substrates with high standards.n n n A polyurethane compound (A), an unsaturated epoxy carboxylic acid ester compound (c), a compound (d) having two hydroxyl groups and one or more carboxyl groups in one molecule, and a dicarboxylic acid having 10 or more carbon atoms The polyester diol compound (e) and the compound (f) having two isocyanate groups in one molecule are obtained by reacting, wherein the unsaturated epoxy carboxylic acid ester compound (c) has one in one molecule. The compound (b) of the above ethylenically unsaturated group and one carboxyl group is obtained by reacting an epoxy compound (a) having two epoxy groups in one molecule. |