http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201827206-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-145 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-621 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C71-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28 |
| filingDate | 2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b3e3a0dda8e3be8b2558829dda2bc0e7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4308752e855a46f4a236d7230610c13 |
| publicationDate | 2018-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201827206-A |
| titleOfInvention | Thermosetting resin composition, resin sealing substrate and electronic device |
| abstract | The thermosetting resin composition of the present invention is used for the formation of a resin-sealed substrate, which satisfies the following condition 1. (Condition 1) After the cured product of the thermosetting resin composition is obtained by transfer molding (175 ° C, 120 seconds), the cured product is subjected to a first heat treatment (175 ° C, 4 hours) with respect to the cured product. The shrinkage ratio of the mold size at 25 ° C is set to S 1 (%), and the second heat treatment is further performed on the cured product (the time when the temperature reaches 190 ° C is t1, and the temperature is raised from the temperature of 190 ° C to 233 ± 3 ° C) When the time when the temperature is lowered to 190 ° C is t2, t2-t1 satisfies 100 ± 50 seconds), the third heat treatment (125 ° C, 2 hours), and the fourth heat treatment (175 ° C, 6 hours) are performed in the order of the above. When the shrinkage ratio of the cured product to the mold size at 25 ° C is set to S 4 (%), the following formula is satisfied: . |
| priorityDate | 2016-09-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 119.