| abstract |
The present invention provides a curable compound having good solvent solubility and capable of forming a cured product having super heat resistance. The curable compound of the present invention is represented by the following formula (1). In formula (1), R 1 and R 2 represent curable functional groups, and D 1 and D 2 represent a single bond or a linking group. L represents a divalent group having a repeating unit that includes a structure represented by the following formula (I) and a structure represented by the following formula (II) (wherein Ar 1 to Ar 3 represent an aromatic ring A group obtained by removing two hydrogen atoms in the structural formula of the formula, or a group obtained by removing two hydrogen atoms from a structural formula obtained by bonding two or more aromatic rings through a single bond or a linking group. X represents -CO -, -S- or -SO 2- , Y represents -S-, -SO 2- , -O-, -CO-, -COO-, or -CONH-. N represents an integer of 0 or more). |