| abstract |
The object of the present invention is to provide a cured reactive polysiloxane gel, which is a soft polysiloxane gel with excellent heat resistance, low elastic modulus, low stress, and excellent stress buffering and flexibility. The polysiloxane gel layer is changed to a hard cured product having higher shape retention and better mold release properties than before curing. Furthermore, the object of the present invention is to provide the use of the silicone gel: an adhesive, a protective agent or a sealant, and a member for manufacturing an electronic component, and further, it is an object to provide a cured product having the cured reactive silicone gel. Electronic parts.n n n A curing reactive polysiloxane gel and a use thereof. The curing reactive polysiloxane gel is obtained by curing a composition containing the following components into a gel state at one time and further having secondary curing reactivity.n n n (A) an organopolysiloxane having at least two curing reactive groups in one molecule, (B) an organohydrogenpolysiloxane containing optionally, and (C) a curing agent. |