http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201817805-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20caa64b571ec98459ceca26e3dd4ecf |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5399 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5313 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate | 2016-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d7035b4c1abac7839ce929b0c35c1300 |
| publicationDate | 2018-05-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201817805-A |
| titleOfInvention | Resin composition suitable for soft and hard bonding plates and application thereof |
| abstract | The invention discloses a resin composition, which comprises an epoxy resin, a hardener, a triallyl isotricyanate containing DOPO, and a phosphazene. The aforementioned resin composition can be made into various articles, such as prepreg, laminated board, printed circuit board, flexible multilayer board or flexible and rigid board, and meets the requirements of low glue flow, low chip loss, high tensile strength at room temperature and high temperature, At least one, more or all of the characteristics such as low dielectric constant, low dielectric loss, high flame retardancy and high heat resistance. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I724806-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I690562-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I719419-B |
| priorityDate | 2016-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 131.