| abstract |
The present invention provides a photosensitive resin composition capable of forming a cured film having excellent adhesion to a metal material, particularly copper, and a high elongation even in a heat treatment at a low temperature. This photosensitive resin composition is characterized by including (A) an alkali-soluble resin having a structural unit represented by the general formula (1), and (B) a photocrosslinking agent.n n n n n n n n n n (In the general formula (1), X 1 and X 2 represent a 2- to 10-valent organic group, Y 1 represents a 2- to 4-valent organic group, and Y 2 represents a bivalent having an aliphatic structure having 2 or more carbon atoms. Organic group, R 1 and R 2 represent hydrogen or an organic group having 1 to 20 carbon atoms; p, q, r, s, and t represent 0 ≦ p ≦ 4, 0 ≦ q ≦ 4, 0 ≦ r ≦ 2, 0 ≦ Integers in the range of s ≦ 4, 0 ≦ t ≦ 4; n1 and n2 are integers in the range of 1 ≦ n1 ≦ 500, 1 ≦ n2 ≦ 500, and 0.05 ≦ n1 / (n1 + n2) <1, each The arrangement of the repeating unit may be a block or a random one). |