| abstract |
Provided are a resin composition excellent in heat resistance and dry etching resistance and suitable for use as a resin material for photoresist, a cured product thereof, a resin material for photoresist formed using the resin composition, and a photoresist film. A resin composition containing an epoxy resin (A) having a polyarylene ether structure (α) and a naphthol novolac-type phenol resin (B), a cured product thereof, and the resin composition Photoresist resin material and photoresist film. |