| abstract |
The present invention relates to an acidic aqueous composition (electroplating bath) for electrolytic copper plating (electrolytic deposition of copper), the composition comprising: (i) copper (II) ions, (ii) one or more than one formula ( Ia) Compound , (Iii) one, two, three or more than three other compounds, which are different from the compound of formula (Ia), and the definitions given below, according to the use of the acidic aqueous composition of the present invention for electrolytic copper plating, The use of the compound of formula (Ia) in the acidic aqueous composition for electrolytic metal plating, a method for electrolytic copper plating using the acidic aqueous composition according to the present invention and the derivative of the acidic aqueous composition for electrolytic metal plating The specific compound of (Ia). |