| abstract |
The invention discloses a resin composition, which comprises an epoxy resin, a high molecular weight polyetheramine, and an amino-terminated nitrile rubber. The aforementioned resin composition can be made into various articles, such as prepreg, laminated board, printed circuit board or flexible and rigid board, and meets the requirements of low glue flow, low chip loss, high tensile strength at room temperature and high temperature, and low moisture absorption. At least one, more or all of the characteristics such as high gel stability. |