| abstract |
The invention is a method for manufacturing a ceramic wafer, which includes a forming step and a processing step, etc .; wherein, the processing step includes forming a positioning notch, a positioning flat edge and a guide angle, so that the ceramic wafer can be cut and polished And during polishing, there will be no processing defects to improve the yield, and the ceramic powder for preparing ceramic wafers includes nitride ceramic powder, oxide ceramic powder and carbide ceramic powder. The ceramic wafer of the invention has the characteristics of low dielectric constant, good insulation and good heat dissipation, and can be applied to semiconductor manufacturing processes, electronic products and semiconductor equipment, and used as electronic products. |