| abstract |
The present invention provides a resin composition capable of obtaining a cured film having chemical resistance, low stress, and high elongation even in a low-temperature heat treatment.nn n n A resin composition containing (a) an alkali-soluble resin containing a phenol skeleton having a crosslinkable group and a phenol skeleton having no crosslinkable group and having a weight average molecular weight in a range of 1,000 to 50,000 It is characterized in that the content ratio of the phenol skeleton having a crosslinkable group in the total content of the structural unit of the phenol skeleton having a crosslinkable group and the phenol skeleton having no crosslinkable group is 100 mol% In the range of 5 to 90 mole%. |