| abstract |
The object of the present invention is to provide batch moldable wafers, especially for large-diameter thin film wafers, which have good moldability, and at the same time, after molding, give low warpage, good wafer protection performance, and good Adhesiveness, good reliability and good heat resistance, can perform the molding process well, can be applied to the resin composition and resin film of wafer-level packaging, provide a method of manufacturing the resin film, and A semiconductor device molded with a resin film, and a method of manufacturing the semiconductor device. The solution of the present invention is a resin composition characterized by comprising: polysiloxane resin (A), (B) epoxy resin having a weight-average molecular weight of a structural unit represented by the following composition formula (1) of 3,000 to 500,000 Resin hardener and (C) filler. |