http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201808069-A

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assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c19a91365ed494d9fe27d24190d4459f
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
filingDate 2016-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b008bd1b914aa4ec8f258f5e7429c59a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_912abd59e54c1deb7789b09d2ab8caa9
publicationDate 2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201808069-A
titleOfInvention Circuit board manufacturing method
abstract The method for manufacturing a circuit board includes a step of preparing a core substrate, a first forming step, and a second forming step. The step of preparing the core substrate is to prepare a core substrate having an insulating layer containing a thermoplastic resin, a first circuit formed on one surface of the insulating layer, and a planar metal layer bonded to the other surface of the insulating layer. The first forming step is to form, on the first surface of the first circuit on which the core substrate is disposed, a first adhesive layer containing a resin component having a lower softening point than a thermoplastic resin and a first metal foil. This sequence is configured to integrate the layers. The second forming step is: in the laminated body obtained in the first forming step, patterning the metal layer, and forming a second circuit on the second surface of the metal layer on which the core substrate is disposed, the second layer is The second adhesive layer and the second metal foil of the resin component having a low softening point of the softening point of the plastic resin are arranged in this order to integrate the layers.
priorityDate 2016-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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