| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_758994071efb42b565fc2c04637be131 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-067 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-308 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 |
| filingDate |
2017-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dda556a52e15f045c6170e1f31d178ae
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4dea98bab57f16cc378ba46cf8b91a8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1bacae0120e81fcefbf68efe6f63b6da |
| publicationDate |
2018-03-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201807164-A |
| titleOfInvention |
Etching liquid and method of manufacturing electronic substrate |
| abstract |
An object of the present invention is to provide an etching solution capable of selectively removing copper and / or copper alloy from a substrate having copper and / or copper alloy and nickel and / or nickel alloy.nn n n The etching solution of the present invention is an etching solution for etching the copper and / or copper alloy from a substrate having copper and / or a copper alloy and nickel or a nickel alloy. The etching solution contains an organic acid (A) and an oxidizing agent (B). The acid dissociation constant (pKa) of the organic acid (A) is -1.10 to 2.60, using nickel as the working electrode, using Ag / AgCl filled with saturated KCl solution as the reference electrode, and using the above etching solution as the electrolyte solution. 1 The corrosion potential is 0.1V to 0.5V. |
| priorityDate |
2016-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |