| abstract |
The present invention provides a method for packaging a substrate on which a semiconductor element is mounted. When a large area of silicon wafer or substrate is packaged together with a resin composition, molding defects such as unfilling and flow marks do not occur. This encapsulation method uses a hardening epoxy resin composition containing (A) an epoxy resin, (B) a hardener, (C) a pregelatinizing agent, and (D) a filler, and compression-molding in (a) (B) Molding temperature: 100 ~ 175 ° C, (c) Molding time: 2-20 minutes and (d) Molding pressure: 50 ~ 350kN. Encapsulate a large area silicon wafer or substrate together. |