| abstract |
Embodiments of the present invention provide a package structure. The package structure includes a wafer, a molded component, and a rewiring circuit structure. The wafer includes a semiconductor substrate, a connector, and a passivation layer. The semiconductor substrate has an upper surface. The connector is disposed above the upper surface of the semiconductor substrate. The passivation layer is disposed over the upper surface of the semiconductor substrate and exposes a portion of the connector. The molding member laterally surrounds the semiconductor substrate, wherein the upper surface of the molding member is higher than the upper surface of the semiconductor substrate and the molding member forms a hook structure, and the hook structure is hung on the edge portion of the semiconductor substrate. The rewiring circuit structure extends over the passivation layer and over the molding element, as well as electrically connecting the connectors. |