http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201803937-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate | 2017-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50976b74e9c18a56d0f160e617664e9b |
| publicationDate | 2018-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201803937-A |
| titleOfInvention | Resin sheet |
| abstract | The resin sheet of the present invention is a resin sheet used in a solder resist and provided with a carrier substrate and a resin layer. The resin layer is disposed on the carrier substrate and is composed of a resin composition for a solder resist. The thickness of the resin layer is 1 μm. Above 50 μm, the minimum value of the complex dynamic viscosity at the B-stage state of the resin layer based on the dynamic viscoelasticity test range of 50 to 200 ° C, a heating rate of 3 ° C / min, and a frequency of 62.83rad / sec When η is set, η is 100 Pa · s or more and 3000 Pa · s or less, and the storage elastic modulus of the cured product of the resin layer at 30 ° C. is 7 GPa or more and 40 GPa or less. |
| priorityDate | 2016-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.