| abstract |
The present disclosure is directed to the field of fabricating microelectronic packages in which a cavity is formed in a dielectric layer deposited on a first substrate to maintain separation between the interconnected interconnects. In an embodiment, the cavities may have sloping sidewalls. In another embodiment, a solder paste can be deposited in the cavities and a solder structure can be formed after heating. In other embodiments, the solder structures can be placed in the cavities or the solder structures can be formed on a second substrate to which the first substrate can be attached. In still other embodiments, a solder structure can be formed on the first substrate and the second substrate. The solder structures can be brought into contact and reflowed to contact pads or solder structures on the second substrate, and the solder structures are used to form solder interconnects. |