| abstract |
The present invention relates to a curable composition comprising a epoxy compound represented by the following formula (1) and a cured product selected from the group consisting of a thermally-induced cationic polymerization initiator, an acid anhydride-based curing agent, and a curing accelerator, and a cured product thereof. And a photocationic polymerization initiator. This curable composition is useful in that a cured product having high heat resistance can be produced. (In the formula, A represents CR 17 R 18 , B represents CR 19 R 20 , R 1 to R 20 each independently represent hydrogen, a substituent selected from the group consisting of an alkyl group and an alkoxy group, and n is 0 or 1, where m is 1 when n is 0, and m is 0 when n is 1) |