| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10378
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29313
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29318
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29324
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-27003
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81193
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29379
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-2937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-9211
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76841
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-481
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-4828
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-33
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-27
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-142 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate |
2017-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed25881588bc86c4927f3732e51f339a |
| publicationDate |
2018-01-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201801205-A |
| titleOfInvention |
Anisotropic conductive bonding member, semiconductor element, semiconductor package, and method of manufacturing the same |
| abstract |
An object of the present invention is to provide an anisotropic conductive bonding member capable of achieving excellent conduction reliability and insulation reliability, and a semiconductor element, a semiconductor package, and a method for manufacturing a semiconductor element using the same. The anisotropic conductive bonding member of the present invention includes: an insulating base material including an inorganic material; a plurality of conductive paths including a conductive member provided in a state of being penetrated in the thickness direction of the insulating base material and mutually insulated; and The adhesive layer is provided on the surface of the insulating substrate. Each conductive path includes a protruding portion protruding from the surface of the insulating substrate. The protruding portion of each conductive path is buried in the adhesive layer. The adhesive layer contains a polymer material and an antioxidant material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112384994-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112384994-B |
| priorityDate |
2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |