| abstract |
The present invention relates to a positive photosensitive resin composition and a protective film formed of the positive photosensitive resin composition, which is used for forming a planarizing film for a TFT substrate, an interlayer insulating film, or a core material of an optical waveguide or A clad material which has excellent insulating properties. The positive photosensitive resin composition contains an alkali-soluble resin (A), an o-naphthoquinonediazide sulfonate (B), and a compound selected from at least one of the group consisting of a thermal acid generator and a thermal base generator ( C), a cyclic siloxane compound (D) and a solvent (E). |