| abstract |
Embodiments of the present invention provide a structure and a method of forming the same. The structure includes a first dielectric layer overlying the first substrate. A first connection pad is placed in a top surface of the first dielectric layer and contacts the first redistribution. A first dummy pad is placed in the top surface of the first dielectric layer, the first dummy pad contacting the first redistribution. The second dielectric layer is overlaid on the second substrate. a second connection pad and a second dummy pad are disposed in a top surface of the second dielectric layer, the second connection pad is bonded to the first connection pad, and the first dummy pad is deviated from the second dummy pad The method is positioned such that the first dummy pad and the second dummy pad do not contact each other. |