http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201740194-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_268be9afa00cf55b5aa72b1612151ecb |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C381-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-039 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 |
| filingDate | 2017-01-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24fc1b958be16a1abc66d8bdf424bf85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9b6f071b88bec830fff78d4e3b63d2f0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_24ef466fc3607e925bf3e57161456513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_57d69c998ba644a25a483999a8d015ba http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2755db4cf58164bd00e91fcc1d759dcc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d773c26933f47f09f8fae9fcf14edf1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_421dd0f7b8a0766ac6945e660bf5c106 |
| publicationDate | 2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201740194-A |
| titleOfInvention | Pattern forming method, method of manufacturing electronic component, and resin composition |
| abstract | The present invention provides a pattern forming method, a method of manufacturing an electronic component including the pattern forming method, and a sensitized ray-sensitive or radiation-sensitive resin composition for the pattern forming method, the pattern forming method including: a step of forming a sensitized ray-sensitive or radiation-sensitive film on a substrate by a sensitizing ray-sensitive or radiation-sensitive resin composition, and illuminating the sensitized ray in such a manner that an exposure region having a scanning speed of 400 mm/sec or more exists a step of performing immersion exposure on a linear or sensitizing radiation film, and a step of developing the exposed sensitized ray-sensitive or radiation-sensitive film using a developing solution to obtain a pattern, and by the sensitizing ray or The pattern forming method in which the radiation-sensitive resin composition satisfies the following conditions can efficiently form a resist pattern having excellent in-plane uniformity of the pattern line width. Condition: By setting the exposure amount to "the 1:1 line having a line width of 50 nm and the exposure amount A of the space resist pattern by immersion exposure with a scanning speed of 300 mm/sec" The line width of the resist pattern formed by immersion exposure having a scanning speed of 300 mm/sec is set to A nm, and the exposure amount is set to the exposure amount A and the scanning speed is set to 100 mm. When the line width of the resist pattern formed by immersion exposure is set to B nm, the line width variation |AB| is 0.5 nm or less. |
| priorityDate | 2016-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 180.