http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201738959-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_fa03ea4653dcf205c9dc1b4bf0520beb |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 |
| filingDate | 2016-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0ada14f9faa70179f0e39e0aba7b277a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_575ee511f147c646bfb15d179b415281 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3840148c56b21483cd818af6abe235b |
| publicationDate | 2017-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201738959-A |
| titleOfInvention | Pre-alignment method before wafer etching |
| abstract | The present invention is a pre-alignment method for wafer etching, which mainly forms an alignment groove along a crystal orientation of a substrate; the alignment groove formed by the creation can be formed by a mask in a subsequent process. The alignment groove is aligned first to precisely align the crystal orientation of the photomask and the crucible substrate to avoid the crucible substrate in the subsequent process, because the photomask and the crucible substrate are not precisely aligned, thereby causing the crucible substrate The predetermined lattice size and the actual lattice size cause errors, which leads to subsequent processes, and the pattern of the reticle cannot be correctly formed on the relative position of the ruthenium substrate, causing short circuit, open circuit or poor electrical condition of the subsequent electronic product. |
| priorityDate | 2016-04-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.