| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eedd2a00c4d0ba56ecf05fb4b97592dd |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2016-12-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8dc9e5192513faf9b90c97711e270725
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4e2040697d5d0d05b3e34c52e120bc5b |
| publicationDate |
2017-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201737429-A |
| titleOfInvention |
Semiconductor sealing material |
| abstract |
The present invention provides a semiconductor sealing material capable of suppressing gap formation between a semiconductor wafer and a semiconductor sealing material. The sealing material for a semiconductor of the present invention is characterized by comprising an oxidizing agent that oxidizes a semiconductor. |
| priorityDate |
2015-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |