http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201737334-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a665d61597c2731ab4130971ee397dc9 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B57-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1454 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02024 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02052 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-11 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 |
| filingDate | 2017-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c4bd47af58356990176dc9f3eaf5acb4 |
| publicationDate | 2017-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201737334-A |
| titleOfInvention | Grinding method of crucible substrate and composition set for polishing |
| abstract | The present invention provides a substrate polishing method capable of reducing PID and a polishing composition kit used in the polishing method. The ruthenium substrate polishing method provided by the present invention comprises a preliminary grinding step and a finishing grinding step. The preliminary grinding step includes a plurality of preliminary grinding stages performed on the same platen. The plurality of preliminary polishing stages include a final preliminary polishing stage in which the final preliminary polishing slurry PF is supplied to the tantalum substrate. In the final preliminary polishing stage, at least one of the total Cu weight and the total Ni weight in all of the final preliminary polishing slurry PF supplied to the tantalum substrate is 1 μg or less. |
| priorityDate | 2016-02-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 117.