| abstract |
The problem to be solved by the present invention is to provide a liquid solder resist composition which is capable of forming a solder resist layer having a glossy and highly smooth surface, although it contains a powdery hydroquinone epoxy compound. The liquid solder resist composition of the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), and a photopolymerization initiator (D). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by the formula (1). □ |