| abstract |
The present disclosure provides a packaging method including providing a first semiconductor substrate, forming a bonding region on the first semiconductor substrate, wherein the bonding region of the first semiconductor substrate includes a first bonding metal layer and a second bonding a second semiconductor substrate having a bonding region, wherein the bonding region of the second semiconductor substrate comprises a third bonding metal layer; and contacting the bonding region of the first semiconductor substrate by the second The bonding region of the semiconductor substrate bonding the first semiconductor substrate to the second semiconductor substrate; wherein the first and third bonding metal layers comprise copper (Cu), and the second bonding metal layer comprises tin (Sn). The disclosure also provides a related package structure. |