http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201732082-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c98de5e2caeca997fd58bbc1295f75ca |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C14-34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-04 |
| filingDate | 2016-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c2f73e91075ad76099fff2735b78cfdc http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8400b975e5ab56a0fba9518093c19dfd |
| publicationDate | 2017-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201732082-A |
| titleOfInvention | Carrier copper foil with sputtered inorganic composite film and preparation method thereof |
| abstract | A carrier-attached copper foil with a sputtered inorganic composite film and a preparation method thereof, comprising a substrate, an inorganic composite film and a metal plating layer, the inorganic composite film being formed on the substrate by sputtering, and then being utilized The method of electroplating forms the metal plating layer on the side of the inorganic composite film away from the substrate, and finally, by the lattice mismatching property of the inorganic composite film and the metal plating layer, the metal plating layer can be not damaged. Then, the metal plating layer is peeled off from the inorganic composite film, and the inorganic composite film can maintain its characteristics under high temperature process, and maintains a low bonding strength with the metal plating layer, and does not peel off when the metal plating layer is peeled off. Destroy the metal plating layer. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113416986-A |
| priorityDate | 2016-03-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 50.