| abstract |
An object of the present invention is to provide a resin composition which can reduce the roughness of the surface of the insulating layer, and has good peeling strength, plating penetration depth, part embedding property, and flame retardancy of the insulating layer and the conductor layer after the roughening treatment; A sheet-like laminate of the resin composition, a printed wiring board including an insulating layer formed of a cured product of the resin composition, and a semiconductor device. The solution of the present invention is a resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an alkoxydecane compound containing a fluorine atom, and (D) an inorganic filler. |