abstract |
A resin composition comprising: (a) a thermosetting resin system having a dielectric loss (Df) of not more than 0.004 at a frequency of 10 GHz; and (b) an alkenylphenoxy polyphosphazene component, wherein The content of the component (b) is from 1% by weight to 30% by weight based on the total weight of the resin system (a) and the component (b). |