| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_456c9d06b68e1386824ce5a283092e27 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-187
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-426
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0278
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0236
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-105 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-185
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-182 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2016-11-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_92ef094f43c7fa59a7b08f52dc300eb6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_18ba08891f40b3214ad5c17a7992dae6 |
| publicationDate |
2017-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
TW-201729656-A |
| titleOfInvention |
Modification method for manufacturing laminate used in printed circuit boards |
| abstract |
A method of modifying a laminate used in the manufacture of printed circuit boards, which permits the use of laminates for the manufacture of printed circuit boards by the removal process for the manufacture of printed circuit boards by additive or semi-additive methods. The modification of the laminate used in the manufacture of printed circuit boards lies in the following two processes: 1. Adding a catalytic material to the laminated board containing the resin, which is a composite oxide of photoactive titanium oxide (TiO2), which is used in comparison. The weight of the resin is at least 10% by weight, preferably 10% to 40% by weight. 2. The surface of the laminate produced in the first process will be unrolled to at least 150% of its surface before deployment. |
| priorityDate |
2015-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |