http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201728802-A

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filingDate 2016-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ec7b00636d6e06dcffbf19d0bc63777
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publicationDate 2017-08-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201728802-A
titleOfInvention Circuit substrate and preparation method thereof
abstract The invention provides a preparation method of a pre-treated Low Dk type fiberglass cloth for constituting a circuit substrate, which comprises using a Dk having Dk and a Low Dk type fiberglass cloth used at different temperatures and having a small Df. The treatment glue is used to pretreat the Low Dk type fiberglass cloth. The present invention also provides a bonded sheet and a circuit substrate which are prepared by the above method. In the method for preparing a circuit board of the present invention, the Dk of the prepared circuit substrate has a small difference in the warp and weft directions, and the signal delay problem can be effectively solved, and the Df of the circuit substrate is small, so that the signal loss of the circuit substrate is also small. At the same time, the cured, partially cured or uncured dry glue obtained by pretreatment of the glue drying solvent has similar dielectric properties to the Low Dk type fiberglass cloth used at different temperatures, so that the signal delay of the circuit substrate at different temperatures is obtained. They are very small.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I704185-B
priorityDate 2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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