| abstract |
The present invention provides a resin composition comprising a resin composition of (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler, and a resin composition hardened by heating at 180 ° C for 30 minutes. The hardness (HV1) satisfies the formula (i): 40 < HV1 < 220, and the relationship between the HV1 and the Vickers hardness (HV2) of the resin composition which is cured by heating at 180 ° C for 90 minutes satisfies the formula (ii): 1 < HV2 / HV1 <1.5, and the glass transition temperature of the resin composition hardened by heating at 180 ° C for 90 minutes was 140 ° C or higher. |