| abstract |
The present invention provides a laminate which has high adhesion to a low-polar resin substrate or a metal substrate such as LCP, and a low-polarity resin substrate or a metal substrate such as LCP, and can obtain high solder heat resistance and low dielectric Excellent electrical properties and flame retardancy. A laminate (Z) comprising a resin substrate and a metal substrate laminated via an adhesive comprising a carboxyl group-containing polyolefin resin (A); characterized by: (1) an adhesive layer at a frequency of 1 MHz The relative dielectric constant (εc) is 3.0 or less, (2) the dielectric tangent (tan δ) of the adhesive layer at a frequency of 1 MHz is 0.02 or less, and (3) the peel strength between the resin substrate and the metal substrate is 0.5 N. /mm or more, (4) The heat resistance of the solder of the laminate (Z) is 240 ° C or higher, and (5) the laminate (X) of the adhesive layer and the resin substrate is VTM- in the UL-94 method. 0. |