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publicationDate 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201727788-A
titleOfInvention Metrology system and measurement method using the same
abstract A method for thickness measurement comprising forming an implanted region within a semiconductor substrate. A semiconductor layer is formed on the implanted region of the semiconductor substrate. The regulated free carrier is generated in the implanted region of the semiconductor substrate. A probe beam is provided onto the implanted region of the semiconductor layer and the semiconductor substrate having the regulated free carrier. The probe beam reflected from the semiconductor layer and the implanted region is detected to determine the thickness of the semiconductor layer.
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