| abstract |
A method of removing scum from a dielectric layer is provided. In one embodiment, a dielectric layer is deposited over the substrate and coated with a photoresist, exposed to exposure and developed after coating the photoresist. Once the pattern of photoresist is transferred to the underlying dielectric layer, a scum removal process is performed in which the scum removal process utilizes a mixture comprising a carbonaceous precursor, a scum precursor, and a carrier gas. The mixture is ignited to treat the plasma and the treated plasma is applied to the dielectric layer to remove scum from the dielectric layer. |