http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201724162-A

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filingDate 2016-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d1312bb782ced042ef67a27c423aa9b6
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publicationDate 2017-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber TW-201724162-A
titleOfInvention Processing method of processed object
abstract An object of the present invention is to provide a method for achieving control of a minimum line width with high precision, reproducibility of a minimum line width, and the like in pattern formation on a target object. The solution of the present invention is to provide a process for forming a first process for supplying a first gas containing an amine-based decane-based gas into a processing chamber of a plasma processing apparatus, and a second process for After the implementation of the first process, the space in the processing container is rinsed; the third process is the plasma of the second gas containing the oxygen-containing gas in the processing container after the execution of the second process; and the fourth process is the third process. After the process is carried out, the space in the processing container is rinsed; the sequence is repeated to form a tantalum oxide film in the processing container: the preparation process is performed before the object to be processed is stored in the processing container; and the processing process is carried out. The object to be processed in the processing container is subjected to etching treatment; the preparation process is performed before the processing process; the forming process is performed in the preparation process and is performed in the processing process; and the first process does not generate the plasma of the first gas.
priorityDate 2015-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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