http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-201723124-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_15beb6523137220f9bf55f2b37b39003 |
| classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21Y115-10 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F21S2-00 |
| filingDate | 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_badbda48000ef4cc97abd4c2adcc8209 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a85ee58f09fd87619130c004dc10fd70 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_43e728646ecaae6e5dafc60702519812 |
| publicationDate | 2017-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | TW-201723124-A |
| titleOfInvention | LED lamp, LED lamp manufacturing method and LED device sealing method |
| abstract | An LED lamp formed of: a die substrate, wherein the substrate is formed with a semiconductor material; an electrode for applying a bias voltage across the semiconductor material to cause light emitted therefrom; and the die The substrate is bonded to the adhesive of the support substrate, wherein the adhesive is a polymeric siloxane polymer having a thermal conductivity greater than 0.1 watts/meter gram (W/(m·K)), wherein the adhesive The light is absent, wherein the siloxane polymer has ruthenium and oxygen in the polymer backbone, and an aryl or alkyl group bonded thereto, and wherein the binder further comprises particles having an average particle size of less than 100 microns. |
| priorityDate | 2015-12-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 228.