| abstract |
This invention relates to phenolphthalein-containing polyphenylene ethers. In particular, the present invention relates to phenolphthalein modified polyphenylene ethers having the structural formula wherein D, X, Y, Z and b are as described herein. The resin obtained by using the phenolphthalein-modified polyphenylene ether resin of the present invention or a prepolymer thereof can simultaneously ensure better heat resistance, dielectric properties, flame retardancy, and low thermal expansion rate. Accordingly, the finished resin product (such as a prepreg, a laminate or a printed circuit board) can be applied to electronic products with high speed and high frequency signal transmission, thereby further improving the reliability, heat resistance and dimensional stability of the electronic product. |