| titleOfInvention |
Compound, resin, resist composition or radiation-sensitive composition, method for forming resist pattern, method for producing amorphous film, underlayer film forming material for lithography, composition for forming underlayer film for lithography, circuit pattern Formation method and purification method |
| abstract |
In the present invention, a compound represented by the following formula (1) and/or a resin containing the compound as a constituent component are used. □ (In the formula (1), R1 is a 2n-valent group or a single bond having a carbon number of 1 to 60, and R2 to R5 are each independently a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms. An aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a halogen atom, a thiol group, a hydrogen atom or a hydroxyl group having an acid dissociable group (acid) Dissociable group), but at least one of R2 to R5 is a group in which a hydrogen atom of a hydroxyl group is substituted with an acid dissociable group, and m2 and m3 are each independently an integer of 0-8, and m4 and m5 are each independently 0. An integer of ~9, but no m2, m3, m4, and m5 are 0 at the same time, n is an integer from 1 to 4, and p2 to p5 are each an integer of 0 to 2). |