| abstract |
A metal patch is suitable for connecting a high power component to a substrate. The metal patch includes an intermediate metal layer, two first metal layers, and two second metal layers. These first metal layers are respectively disposed on opposite sides of the intermediate metal layer. An intermediate metal layer is located between the first metal layers. The melting point of each of the first metal layers is greater than 800 degrees Celsius. These second metal layers are respectively disposed on the first metal layers. An intermediate metal layer and the first metal layers are between the second metal layers. The material of each of the second metal layers includes an indium tin alloy. Each of the first metal layers and the corresponding second metal layer can generate a intermetallic via a solid-liquid diffusion reaction. |