| abstract |
The invention provides a circuit board stencil printing method for manufacturing a printed circuit board, the method comprising the steps of opening and opening a circuit board after the opening, the method further comprising a circuit diagram printing step, by using a first steel a screen, a squeegee and a conductive ink to print the circuit pattern on the first steel mesh to the circuit board after the opening; the solder resist printing step, printing the solder resist material by a second steel mesh and the squeegee To the circuit board; the text and mark printing step, printing the characters and marks on the third steel mesh onto the circuit board by a third steel mesh, the scraper and the ink; and the solder paste printing step, Solder paste is printed onto the circuit board by a fourth steel mesh and the squeegee. |