abstract |
An object of the present invention is to provide a conductive paste for laser processing, in which a conductive film capable of forming fine signal wiring by laser processing can be obtained. The conductive paste for laser processing of the present invention contains a binder resin, conductive fine particles, and a dispersant, and has a viscosity of 10 Pa·s to 150 Pa measured at a temperature of 25 ° C and a rotor rotation speed of 5 rpm using an E-type viscometer. · s, and the thixotropic index is 1.2 to 2.4. |